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| MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes Features Low Series Resistance Ultra Low Capacitance Millimeter Wave Switching & Cutoff Frequency 2 Nanosecond Switching Speed Can be Driven by a Buffered TTL Silicon Nitride Passivation Polyimide Scratch Protection RoHS Compliant V4 Chip Dimensions MA4AGP907 and MA4AGFCP910 Description M/A-COM Technology Solutions MA4AGP907 and MA4AGFCP910 are Aluminum Gallium Arsenide (AlGaAs) flip-chip PIN diodes. These devices are fabricated on OMCVD epitaxial wafers using a process optimized for high device uniformity and exceptionally low parasitics. The end result is a diode with an extremely low RC product, (0.1ps) and 2-3nS switching characteristics. They are fully passivated with silicon nitride and have an added polymer layer for scratch protection. The protective coating prevents damage to the junction and the anode air-bridge during handling and assembly. Applications The ultra low capacitance of the MA4AGP907 and MA4AGFCP910 make them ideal for RF switch and phase shifter applications through millimeter wave frequencies. The diodes are designed for use in pulsed or CW applications, where single digit nS switching speed is required. The low capacitance of these diodes make them ideal for use in microwave multi-throw switch assemblies, where the series capacitance of each "off" port adversely loads the input and affects VSWR. Notes: 1. Gold Pads 14M thick. 2. Yellow areas indicate ohmic gold mounting pads. 3. Dimensions A thru F are identical for both devices INCHES DIM A B C D E F MIN. 0.0260 0.0135 0.0065 0.0043 0.0068 0.0182 MAX. 0.0270 0.0145 0.0075 0.0053 0.0073 0.0192 MIN. 0.6604 0.3429 0.1651 0.1092 0.1727 0.4623 MM MAX. 0.6858 0.3683 0.1905 0.1346 0.1854 0.4877 Absolute Maximum Ratings TAMB = +25C (unless otherwise specified) Parameter Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power (RF & DC ) C.W. Incident Power Mounting Temperature Absolute Maximum MA4AGP907 -50V MA4AGFCP910 -75V -55C to +125C -55C to +150C +175C 50mW +23 dBm +280C for 10 seconds * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes Electrical Specifications @ TAMB = +25C MA4AGP907 MA4AGFCP910 Typ. 0.018 Max. 0.021 V4 Parameter Symbol Conditions MA4AGP907 -5V,1MHz Units Typ. Max. 0.030 Total Capacitance CT MA4AGFCP910 -10V,1MHz pF 0.025 Total Capacitance 1 Series Resistance CT RS RS -5V, 10GHz +10mA, 1MHz pF 0.020 5.2 ---- 7.0 0.018 ---- 0.021 ---- Series Resistance 2 +10mA, 10GHz 4.2 ---- 5.2 6.0 Forward Voltage VF +10mA MA4AGP907 VR = -50V MA4AGFCP910 VR = -75V 10GHz V 1.33 1.45 1.33 1.45 Reverse Leakage Current 3 IR TRISE TFALL TL A ---- 10 ---- 10 Switching Speed 4 nS 2 ---- 2 ---- Carrier Lifetime IF = 10mA / IREV = 6mA nS ---- ---- 4 ---- Notes: 1) Capacitance is determined by measuring the isolation of a single series diode in a 50 transmission line at 10GHz. 2) Series resistance is determined by measuring the insertion loss of a single series diode in a 50 transmission line at 10GHz. 3) The max rated VR( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10A 4) Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series mounted diode. Driver delay is not included. 2 * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes Typical RF Performance @ TAMB = +25C MA4AGP907 Typical Insertion Loss vs. Frequency I. Loss @5mA I. Loss @15mA I. Loss @50mA V4 0.0 Insertion Loss(dB) Insertion Loss (dB) -0.2 -0.4 -0.6 -0.8 2 4 6 8 10 12 14 16 18 20 22 24 Frequency (GHz) Frequency (GHz) 26 28 30 32 34 36 38 40 M A4AGFCP910 Typical Insertion Loss vs. Frequency 0.0 5mA 10mA 15mA -0.2 Insertion Loss (dB) 15 m A 10 m A 5 mA L s (d ) os B -0.4 -0.6 -0.8 2 10 18 Frequency (GHz) Frequency (GHz) 26 34 42 50 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes Typical RF Performance @ TAMB = +25C V4 MA4AGP907 Typical return Loss vs. Frequency ( Either Port ) R. Loss @5mA R. Loss @15mA R. Loss @50mA -20.0 -22.0 -24.0 R tu L s (d ) e rn o s B -26.0 -28.0 -30.0 -32.0 -34.0 -36.0 -38.0 2 3 4 5 6 7 8 9 1 0 1 1 1 2 1 3 1 4 1 5 50 -40.0 Frequency (GHz) M A4AGFCP910 Typical Return Loss vs. Frequency ( Either Port Direction ) 0 5mA -5 10mA 15mA Return Loss (dB) -10 15 m A 10 m A 5 mA Rt r L s ( B eu n o s d ) -15 -20 -25 -30 -35 2 10 18 26 34 42 Frequency (GHz) Frequency (GHz) 4 * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for Frequency (Hz) development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes Typical RF Performance @ TAMB = +25C MA4AGP907 Typical Isolation vs. Frequency V4 Isolation @ -10V -5.0 Isolation @ 0V Isolation @ -1V -10.0 Iso latio (dB n ) -15.0 -20.0 -25.0 -30.0 -35.0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 50 Frequency (GHz) MA4AGFCP910 Typical Isolation vs Frequency 0 -5 Isolation Loss (dB) -10 Isolation (d ) B -15 -20 -25 0V 5V -30 -35 2 10 18 26 34 42 Frequency (GHz) Frequency (GHz) 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes Device Installation Guidelines Cleanliness These devices should be handled in a clean environment. The chips are resistant to solvents and may cleaned using approved industry standard practices. V4 Static Sensitivity Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. These devices are rated Class 0, ( 0-199V ) per HBM MIL-STD-883, method 3015.7 [C = 100pF 10%, R = 1.5kW 1%]. Even though tested die pass 50V ESD, they must be handled in a static-free environment. General Handling The devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil. Assembly Requirements using Electrically Conductive Silver Epoxy and Solder These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silk-screened circuits using electrically conductive silver epoxy, approximately 1-2 mils in thickness and cured at approximately 90C to 150C per manufacturer's schedule. For extended cure times, > 30 minutes, temperatures must be below 200C. Eutectic Die Attached Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge the gold on the contact Pads exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80/20, Au/Sn type solders are acceptable. Maximum soldering temperature must be kept below 280C for less than 10 seconds. Note: The MA4AGSBP907 which is a solder bumped version of the MA4AGP907, is also available. The datasheet can be viewed on the M/A-COM website at: http://www.macom.com/DataSheets/MA4AGSBP907.pdf Circuit Pad Layout Ordering Information Part Number MA4AGP907 MADP-001907-13050P 0.013" Packaging Gel Pack Pocket Tape 0.012" (2) PL Part Number MA4AGFCP910 MADP-000910-13050P Packaging Gel Pack Pocket Tape 0.008" (2) PL 6 * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. |
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